George's Symposium

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Current Trends in Solid Mechanics - A Symposium in Honor of Professor George C. Sih

Chengdu, China
October 16-20, 2009

Symposium Aim

This symposium will recognize Professor G. C. Sih’s immeasurable and incomparable contributions in the areas of solid mechanics, fracture mechanics, and thermal mechanics.

Professor Sih is a pioneer in the development of liner-elastic fracture mechanics for brittle materials, which laid a foundation for his and others development of elastic-plastic fracture mechanics. Recognizing the fact that material separation does not occur instantaneously, Professor Sih developed an innovative approach to correlate the local failure to global failure and provide a fundamental understanding of the effect of the characteristics of microstructure and damage on the constitutive and fracture behavior of metallic materials. His strain energy density theory predicts both the onset of crack growth and the direction of crack extension under mode I and mixed-mode loading conditions. It represents the first unified theory of fracture mechanics and has been used to investigate crack growth behavior in brittle and ductile materials. In addition, Professor Sih developed an isoenergy density theory which can be use to analyze the deformation fields and the evolution of inhomogeneity of material response near interfaces and determine the debonding instability of a bonded system.

Due to his cutting edge research, Professor Sih’s work opened up new avenues of mechanics research of engineering materials and contributed significantly to the all-important field of structural safety and durability.

Symposium Topics

symposium topics include but are not limited to the following topics:

- Solid Mechanics
- Fracture Mechanics
- Experimental Mechanics
- Damage Mechanics
- Strength of Engineering Materials
- Nondestructive Testing and Evaluation

Symposium Chairman

Dr. Chi Tsieh Liu, Southern Illinois University, U.S.A.

Symposium Co-Chairmen

Professor Shan-Tung Tu, East China University of Science and Technology;
Professor Zhengdong Wang, East China University of Science and Technology.

Members of Organizing Committee

Bill Chao, University of South Carolina, U.S.A.
C.K. Chao , National Taiwan University of Science and Technology, Taiwan
E.P. Chen, Sandia Labs, U.S.A.
E. Gdoutos, Democritus University of Thrace, Greece.
G.Z. Kang, Southwestern Jiaotong University, China
C.T. Liu, Southern Illinois University, U.S.A.
Hongbing Lu, Oklahoma State University, U.S.A.
G.H. Nie, Tongji University, China
G. Ravichandran, California Institute of Technology, U.S.A.
C.T. Sun, Purdue University, U.S.A.
Suort Thangjithan ,Virginia Polytechnic Institute and State University, U.S.A.
Max Yen, Southern Illinois University, U.S.A
.
Technical Papers

The official language of the conference is English. All papers should be written and presented in English. Accepted papers will be collected in the FM2009 proceedings which will be published by the East China University of Science and Technology Press before the symposium (All abstracts were indexed in ISTP in the previous symposia). Those who wish to have their full papers reviewed and published in the journal of Theoretical and Applied Fracture Mechanics (SCI/EI indexed), please contact Prof. George C. Sih through E-mail: gcs@ecust.edu.cn.

Abstracts (about 300-500 words) and full papersshould be submitted to Dr. Chi Tsieh Liu through E-mail:

liu_c_t@msn.com.

Registration and Accommodation

Registration fee will be 500 USD. The registration fee covers both George's Symposium and FM2009, including admission to all technical sessions, two refreshment breaks each day of the conference, banquet, conference dinners and a copy of the conference proceedings, but not accommodation. Accompanying persons can join for an additional amount of 100 USD, which includes ladies’ program, banquet and conference dinners.

Contact Information

All inquires with reference to the Symposium should be addressed to

Dr. Chi Tsieh Liu
Southern Illinois University
U.S.A.
E-mail: liu_c_t@msn.com.